| PART |
Description |
Maker |
| FLGA |
Fine Pitch Land Grid Array
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| FLGA-SD |
Fine Pitch Land Grid Array - Stacked Die
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| IC280-720-106 IC280-256-211 IC280-69605.AC-08327 I |
Ball Grid Array (FBGA / CSP / LGA)
|
Yamaichi Electronics Co., Ltd.
|
| ADSP-3128JG |
16-BIT, DSP-PIPELINE REGISTER GRID ARRAY 144 PIN
|
Analog Devices, Inc.
|
| CB0565A CB0565B |
Ceramic Ball Grid Termination Arrays
|
TT Electronics.
|
| CA-PLCC84-Z-M-T-01 |
Carrier Adapter 84 Position PLCC ZIF Socket with test points to mini-grid array interface.
|
Ironwood Electronics.
|
| B37830 B37871 |
(B378xx) Multilayer Ceramic Capacitors Array
|
EPCOS
|
| CA-PLCC32-Z-M-T-01 |
Carrier Adapter 32 Position PLCC ZIF Socket with test points to mini-grid array interface. Pin mapping is 1:1.
|
Ironwood Electronics.
|
| BGA-320P-M06 |
PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC
|
Fujitsu Limited
|
| C1632C82312RAC C1632C10012GAC C1632C10112GAC C1632 |
CERAMIC CAPACITOR ARRAY
Four individual capacitors inside one 1206 monolithic structure
|
KEMET[Kemet Corporation]
|
| PM50RVA120 |
CAP ARRAY, 4 X 3300PF 50V 0612X7RCAP ARRAY, 4 X 3300PF 50V 0612X7R; CAPACITANCE:3.3NF; VOLTAGE RATING, DC:50V; CAPACITOR DIELECTRIC TYPE:CERAMIC MULTI-LAYER; SERIES:W3A; TOLERANCE, :10%; TOLERANCE, -:10%; TEMP, OP. MAX:125(DEGREE RoHS Compliant: Yes
FLAT-BASE TYPE INSULATED PACKAGE
|
Mitsubishi Electric Corporation
MITSUBISHI[Mitsubishi Electric Semiconductor]
|
